Assessment of Strains Produced by Thermal Expansion in Printed Circuit Boards

The paper proposed an alternative optical metrology to classical methods (strain gauge measurements and numerical simulation) for strain determination on printed circuit board (PCBs) due to thermal loads. The digital image correlation (DIC) technique was employed to record the strain distribution in some particular areas of the PCB. A thermal load was applied using a heating chamber, and the measurements were performed at four different temperature steps (25 °C, 50 °C, 85 °C and 120 °C). An increase in the principal strains with temperature was observed. For validation, the principal strains on the PCB obtained with DIC were compared with the values from gauge strain measurements and numerical simulation. The conclusions highlighted that DIC represents a technique with potential for strain measurement caused by thermal deformation, with the advantages of full field measurement, less preparation of the surface and good accuracy.