Superhydrophobic Electrodeposited Copper Surface for Robust Condensation Heat Transfer

Superhydrophobic surfaces have great potential for various applications owing to their superior dewetting and mobility of water droplets. However, the physical robustness of nano/microscale rough surface structures supporting superhydrophobicity is critical in real applications. In this study, to create a superhydrophobic surface on copper, we employed copper electrodeposition to create a nano/microscale rough surface structure as an alternative to the nanoneedle CuO structure. The rough electrodeposited copper surface with a thin Teflon coating shows superhydrophobicity. The enhancement of dewetting and mobility of water droplets on copper surfaces by electrodeposition and hydrophobization significantly improved the condensation heat transfer by up to approximately 78% compared to that of copper substrates. Moreover, the nano/microscale rough surface structure of the electrodeposited copper surface exhibits better tolerance to physical rubbing, which destroys the nanoneedle-structured CuO surface. Therefore, the condensation heat transfer of the superhydrophobic electrodeposited copper surface decreased by only less than 10%, while that of the nanoneedle-structured CuO surface decreased by approximately 40%. This suggests that an electrodeposited copper surface can lead to the stable performance of superhydrophobicity for real applications.