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Published on: May 9, 2020
A second DNA binding site on RFC facilitates clamp loading at gapped or nicked DNA
Xingchen Liu1, Christl Gaubitz1, Joshua Pajak1
1Department of Biochemistry and Molecular Biotechnology, University of Massachusetts Chan Medical School, Worcester, United States.
Researchers discovered a new DNA binding site on the yeast clamp loader replication factor C (RFC). This site helps RFC bind to damaged DNA, improving genome repair processes.
Area of Science:
- Molecular Biology
- Genetics
- Biochemistry
Background:
- Clamp loaders, like replication factor C (RFC), are essential for DNA replication, repair, and synthesis.
- RFC facilitates the loading of sliding clamp proteins onto DNA.
- Existing models suggest RFC's primary DNA binding site is sterically hindered by nicked or gapped DNA, common in DNA repair.
Purpose of the Study:
- To investigate the mechanism of RFC binding to nicked or gapped DNA substrates.
- To identify novel DNA binding sites or mechanisms within RFC.
- To understand RFC's role in DNA repair pathways involving damaged DNA intermediates.
Main Methods:
- Biochemical assays to study DNA binding and clamp loading.
- Structural analysis of yeast RFC.
- Genetic analysis of RFC mutants, specifically deletion of the BRCT domain.
Main Results:
- A second, external DNA binding site on yeast RFC was discovered, accessible in its open conformation.
- This external site facilitates initial binding to nicked/gapped DNA, enabling access to the central binding site.
- The external site can unwind DNA, creating a larger single-stranded gap for enhanced RFC binding and ATPase activation.
- Deletion of the BRCT domain, part of the external site, impairs yeast growth under DNA damaging conditions.
Conclusions:
- Yeast RFC possesses an external DNA binding site that enhances its interaction with nicked and gapped DNA.
- This secondary binding site is crucial for efficient clamp loading at DNA repair sites.
- The discovery provides new insights into the adaptability of clamp loaders in managing genomic integrity during DNA repair.
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