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Highly Robust Ti Adhesion Layer during Terminal Reaction in Micro-Bumps.

Chen-Wei Kao1, Po-Yu Kung1, Chih-Chia Chang1

  • 1Department of Materials Science and Engineering, National Taiwan University, Taipei 10617, Taiwan.

Materials (Basel, Switzerland)
|June 24, 2022
PubMed
Summary

Titanium (Ti) adhesion layers show superior attachment with copper-tin intermetallic compounds (IMCs) in micro-bumps compared to chromium (Cr). Aging revealed void formation, but adhesion and strength remained unaffected, ensuring reliability.

Keywords:
adhesion layerintermetallicmicro-jointssolid-state reaction

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Area of Science:

  • Materials Science
  • Surface Engineering
  • Reliability Engineering

Background:

  • Miniaturized electronics utilize micro-bumps, forming intermetallic compounds (IMCs) that enhance wetting.
  • Direct contact between IMCs and adhesion layers raises reliability concerns.

Purpose of the Study:

  • Investigate the terminal reaction between a titanium (Ti) adhesion layer and copper-tin (Cu-Sn) IMCs.
  • Assess the impact of aging on micro-bump reliability and adhesion.

Main Methods:

  • Micro-bumps with Ti adhesion layers were aged at 200 °C.
  • The resulting intermetallic structures and their adhesion were analyzed.
  • Void formation and its effect on bump strength were examined.

Main Results:

  • All micro-bumps formed intermetallic structures with strong attachment to the Ti adhesion layer after aging.
  • Void formation occurred due to differential diffusion rates of Cu and Sn but did not compromise adhesion or strength.
  • Titanium demonstrated superior adhesion of IMCs compared to previously studied chromium systems.

Conclusions:

  • The Ti adhesion layer offers enhanced reliability for Cu-Sn IMCs in micro-bumps.
  • Titanium outperforms chromium in preventing spalling and maintaining adhesion under thermal stress.
  • The study highlights Ti as a promising adhesion material for advanced electronic packaging.