Investigation on SMT Product Defect Recognition Based on Multi-Source and Multi-Dimensional Data Reconstruction

The recognition of defects in the solder paste printing process significantly influences the surface-mounted technology (SMT) production quality. However, defect recognition via inspection by a machine has poor accuracy, resulting in a need for the manual rechecking of many defects and a high production cost. In this study, we investigated SMT product defect recognition based on multi-source and multi-dimensional data reconstruction for the SMT production quality control process in order to address this issue. Firstly, the correlation between features and defects was enhanced by feature interaction, selection, and conversion. Then, a defect recognition model for the solder paste printing process was constructed based on feature reconstruction. Finally, the proposed model was validated on a SMT production dataset and compared with other methods. The results show that the accuracy of the proposed defect recognition model is 96.97%. Compared with four other methods, the proposed defect recognition model has higher accuracy and provides a new approach to improving the defect recognition rate in the SMT production quality control process.