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Using Laser Scanning Microscopy to Determine Electromigration in Molybdenum Disilicide
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Recent Progress in Physics-Based Modeling of Electromigration in Integrated Circuit Interconnects

Wen-Sheng Zhao1, Rui Zhang2, Da-Wei Wang1

  • 1Zhejiang Provincial Key Lab of Large-Scale Integrated Circuit Design, School of Electronics and Information, Hangzhou Dianzi University, Hangzhou 310018, China.

Micromachines
|June 24, 2022
PubMed

Keywords:
agingelectromigrationintegrated circuit interconnectsphysics-based modelingreliability

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