Related Experiment Video

Updated: Sep 6, 2025

In Depth Analyses of LEDs by a Combination of X-ray Computed Tomography CT and Light Microscopy LM Correlated with Scanning Electron Microscopy SEM
10:42

In Depth Analyses of LEDs by a Combination of X-ray Computed Tomography CT and Light Microscopy LM Correlated with Scanning Electron Microscopy SEM

Published on: June 16, 2016

9.4K

Effects of Bonding Materials on Optical-Thermal Performances and High-Temperature Reliability of High-Power LED

Jiaxin Liu1, Yun Mou1, Yueming Huang2

  • 1School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China.

Micromachines
|June 24, 2022
PubMed

Keywords:
Ag nanoparticlebonding materialhigh-power LEDhigh-temperature reliabilitysinteringLED thermal managementNano-Ag bondingHigh-power LED reliabilityThermal resistance in electronics

More Related Videos

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies08:21

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

Published on: March 20, 2015

12.5K
High-resolution Thermal Micro-imaging Using Europium Chelate Luminescent Coatings09:01

High-resolution Thermal Micro-imaging Using Europium Chelate Luminescent Coatings

Published on: April 16, 2017

7.8K

Related Concept Videos

Bonding in Metals02:32

Bonding in Metals

Metallic bonds are formed between two metal atoms. A simplified model to describe metallic bonding has been developed by Paul Drüde called the “Electron Sea Model”. 
47.9K
Variables Affecting Phosphorescence and Fluorescence01:26

Variables Affecting Phosphorescence and Fluorescence

Fluorescence and phosphorescence are essential phenomena in fields like analytical chemistry, biological imaging, and materials science, where they detect molecular properties and visualize cellular structures. Understanding the variables that influence these luminescent behaviors is crucial for maximizing accuracy and efficiency in their applications. These variables can broadly be grouped into chemical structure, solvent properties, and external conditions, each playing a distinct role in...
586
Bonding and Strength of Aggregate01:12

Bonding and Strength of Aggregate

The bond between aggregate particles and the cement matrix is significantly influenced by the shape and surface texture of the aggregates. High-strength concretes benefit from a rougher texture, which leads to stronger bonding due to greater adhesion. Angular aggregates with larger surface areas also enhance this bond. The bonding quality, however, is complex to assess as no universally accepted test exists. Good bonding is indicated when a crushed concrete specimen shows some aggregate...
254
Biasing of P-N Junction01:16

Biasing of P-N Junction

The operation of a p-n junction diode involves various biasing conditions, including forward bias, reverse bias, and equilibrium.
In equilibrium, no external voltage is applied across the p-n junction. The depletion region is formed at the junction interface due to the diffusion of carriers, which leaves behind charged dopants, acceptors on the p-side, and donors on the n-side. These immobile charges create an electric field that prevents further diffusion of carriers. The related energy band...
814