Protocol for deposition of conductive oxides onto 3D-printed materials for electronic device applications

Additively manufactured (AM) three-dimensional (3D) mesostructures can be designed to enhance mechanical, thermal, or optical properties, driving future device applications at the micron to millimeter scale. We present a protocol for transforming AM mesostructures into 3D electronics by growing nanoscale conducting films on 3D-printed polymers. In this generalizable approach, we describe steps to utilize precision thermal atomic layer deposition (ALD) of conducting, semiconducting, and dielectric metal oxides. This can be applied to ultrasmooth, customizable photopolymer lattices printed by high-resolution microstereolithography. For complete details on the use and execution of this protocol, please refer to Huddy et al. (2022).