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Potential Method to Distinguish Copper Molten Marks Using Boundary and Grain Characteristics
Jinyoung Park1, Joo-Hee Kang2, Hyo-Sun Jang2
1Korea Electrical Safety Corporation Research Institute, 111, Anjeon-ro, Iseo-myeon, Wanju-gun 55365, Jeollabuk-do, Korea.
Microstructural analysis of molten copper marks reveals distinct differences between those formed at room temperature (primary-arc beads) and high temperatures (secondary-arc beads). Key factors like Σ3 boundary fraction and grain size can reliably differentiate these short-circuit events.
Area of Science:
- Materials Science
- Metallurgy
- Forensic Science
Background:
- Microstructural changes in molten copper marks are indicators of ambient temperature during short-circuit events.
- Understanding these changes aids in determining fire causes and copper properties.
Purpose of the Study:
- To compare the microstructural characteristics of molten marks formed at different temperatures.
- To identify reliable discriminant factors for distinguishing between primary-arc beads (PABs) and secondary-arc beads (SABs).
Main Methods:
- Electron backscatter diffraction (EBSD) was used to analyze PABs (25 °C) and SABs (600 °C, 900 °C).
- Comparison of Σ3 boundary distribution and grain-size distribution was performed.
- Machine learning techniques (t-SNE, Pearson correlation) were employed for verification.
Main Results:
- Secondary-arc beads (SABs) exhibited a higher fraction of Σ3 boundaries compared to primary-arc beads (PABs).
- The ratio of maximum grain size to total molten mark area was larger in SABs than in PABs.
- Factors such as Σ3 boundary fraction and normalized maximum grain size were identified as reliable discriminators.
Conclusions:
- The fraction of Σ3 boundaries and normalized maximum grain size are effective in distinguishing between PABs and SABs.
- Microstructural analysis, supported by machine learning, provides robust methods for forensic fire investigations involving copper short circuits.
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