Potential Method to Distinguish Copper Molten Marks Using Boundary and Grain Characteristics

Jinyoung Park1, Joo-Hee Kang2, Hyo-Sun Jang2

  • 1Korea Electrical Safety Corporation Research Institute, 111, Anjeon-ro, Iseo-myeon, Wanju-gun 55365, Jeollabuk-do, Korea.

Summary

Microstructural analysis of molten copper marks reveals distinct differences between those formed at room temperature (primary-arc beads) and high temperatures (secondary-arc beads). Key factors like Σ3 boundary fraction and grain size can reliably differentiate these short-circuit events.