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Direct Ink Writing of Phenylethynyl End-Capped Oligoimide/SiO2 to Additively Manufacture High-Performance
Keda Li1,2, Jinghong Ding1,2, Yuxiong Guo2,3
1State Key Laboratory of Applied Organic Chemistry, Key Laboratory of Special Function Materials and Structure Design of Ministry of Education, College of Chemistry and Chemical Engineering, Lanzhou University, Lanzhou 730000, China.
Abstract:
The three-dimensional (3D) printing of a SiO2-filled thermosetting polyimide (SiO2@TSPI) composite with outstanding performance is realized via the direct ink writing (DIW) of polyamide acid (PAA) composite ink and thermal treatment conducted thereafter. The composite ink consists of phenylethynyl-terminated PAA and silica nanoparticles, where the SiO2 nanoparticles serve as the rheology modifier that is necessary for the DIW technique to obtain self-supporting feedstock during 3D printing and the reinforcement filler that is used to enhance the performance of the final composite. As a result, printed parts with complex geometry and robust thermal stability are obtained. Due to the extrusion-based DIW technique, the printed structures exhibit anisotropic mechanical strength that highly depends on printing roads. This simple and convenient means of realizing 3D structures of thermosetting polyimides is a promising strategy in aerospace and other fields.
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