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Coupling of plasmonic nanoparticles on a semiconductor substrate via a modified discrete dipole approximation method
Diogo F Carvalho1, Manuel A Martins2, Paulo A Fernandes1,3,4
1i3N, Department of Physics, University of Aveiro, 3810-193 Aveiro, Portugal. diogocarvalho@ua.pt.
Physical Chemistry Chemical Physics : PCCP
|July 11, 2022
Summary
This study introduces a fast simulation method for metallic nanoparticle arrays on semiconductor substrates. The technique accurately predicts optical properties, aiding in the design of advanced optoelectronic devices.
Area of Science:
- Plasmonics
- Nanophotonics
- Computational Electromagnetics
Background:
- Understanding plasmonic coupling in metallic nanoparticle (NP) arrays is crucial for optoelectronic device development.
- The influence of substrates on NP plasmonic behavior significantly impacts device performance.
Purpose of the Study:
- To develop a computationally efficient semi-analytical method for simulating plasmonic coupling in NP arrays on semiconductor substrates.
- To investigate the effects of NP surface density and substrate presence on optical properties.
Main Methods:
- Utilized Discrete Dipole Approximation (DDA) with an image dipole approach to model NP arrays on a gallium nitride (GaN) substrate.
- Validated the DDA method against Finite Element Method (FEM) simulations for Ag NP dimers and single NPs on GaN.
- Applied the validated method to study square and random Ag NP arrays.
Main Results:
- The DDA method showed good agreement with FEM results in the weak coupling regime.
- Simulations revealed that increased NP surface density on GaN leads to a redshift in dipolar resonance frequency.
- Higher NP surface density also resulted in enhanced near-field effects.
Conclusions:
- The developed DDA-based model provides a fast and accurate approach for predicting the optical properties of large NP arrays on semiconductor substrates.
- This method offers a significant advantage for optimizing plasmonic nanostructures in various optoelectronic applications.
