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Enzymatic Crosslinked Silk Fibroin Hydrogel for Biodegradable Electronic Skin and Pulse Waveform Measurements
Lei Wang1, Simin Peng1, Aniruddha Patil2
1Hubei Provincial Key Laboratory of Green Materials for Light Industry, Hubei University of Technology, Wuhan 430068, China.
Biomacromolecules
|July 13, 2022
Summary
Researchers developed a new silk fibroin (SF) electronic skin (e-skin) using a biocompatible hydrogel. This advanced e-skin offers precise spatial pressure sensing and signal transmission for various applications.
Area of Science:
- Materials Science
- Biomaterials Engineering
- Wearable Electronics
Background:
- Development of portable, controllable, and eco-friendly electronic skin (e-skin) is a significant challenge.
- Existing e-skin technologies often lack biocompatibility, biodegradability, or ease of use.
Purpose of the Study:
- To design and fabricate a biocompatible and biodegradable hydrogel-based e-skin for spatial pressure distribution sensing.
- To utilize silk fibroin (SF) as a hydrogel skeleton for enhanced mechanical sensitivity and create a conductive hybrid film electrode.
Main Methods:
- Fabrication of a silk fibroin (SF) hydrogel with enzymatic crosslinking in weakly acidic media.
- Preparation of a conductive SF/polyvinyl alcohol (PVA) hybrid film electrode via graphite deposition.
- Assembly of an 8x8 pixel SF-based e-skin array.
Main Results:
- The SF sensing unit exhibited high strain sensitivity (4.78), rapid response (<0.1 s), and excellent cycling stability (≥10,000 cycles).
- The fabricated SF-based e-skin demonstrated high biocompatibility and biodegradability.
- The 8x8 pixel e-skin array successfully performed 3D signal transmission, tracking pulse pressure, finger joint movement, and vocal cord vibrations.
Conclusions:
- A novel silk fibroin hydrogel-based electronic skin offers a promising platform for advanced sensory applications.
- The developed e-skin meets desirable criteria for portability, controllability, and environmental friendliness.
- This research lays the groundwork for next-generation electronic devices utilizing biomaterial-based e-skin.

