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Recent Advances in Flexible RF MEMS.

Yingli Shi1, Zhigang Shen2

  • 1School of Materials and Energy, University of Electronic Science and Technology of China (USETC), Chengdu 610054, China.

Micromachines
|July 27, 2022
PubMed
Summary

This review explores flexible radio frequency (RF) Microelectromechanical systems (MEMS) for reconfigurable systems. It details their design, materials, fabrication, and a novel 3D assembly process for researchers.

Keywords:
RF MEMSRF characteristicsbending deformationflexible substratereconfigurable

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Area of Science:

  • Electrical Engineering
  • Materials Science
  • Mechanical Engineering

Background:

  • Flexible Microelectromechanical systems (MEMS) are crucial for reconfigurable radio frequency (RF) systems, including switches, phase shifters, and antennas.
  • Designing and fabricating flexible RF MEMS presents significant structural challenges compared to rigid counterparts and other flexible electronics.

Purpose of the Study:

  • To provide a comprehensive review of flexible RF MEMS, covering their diverse functions.
  • To survey the flexible film materials and fabrication process technologies employed in their development.
  • To introduce a novel fabrication process for reconfigurable 3D RF devices using mechanically guided assembly.

Main Methods:

  • Literature review of existing flexible RF MEMS technologies and applications.
  • Analysis of flexible film materials suitable for RF MEMS.
  • Examination of various fabrication process technologies for flexible RF MEMS.
  • Introduction and description of a mechanically guided assembly process for 3D flexible RF devices.

Main Results:

  • A broad overview of the current state of flexible RF MEMS, highlighting their capabilities and applications.
  • Identification of key materials and fabrication techniques enabling flexible RF MEMS.
  • Demonstration of a viable fabrication approach for complex, reconfigurable 3D RF structures.

Conclusions:

  • Flexible RF MEMS are advancing rapidly, offering new possibilities for reconfigurable RF systems.
  • Understanding materials and fabrication processes is key to overcoming design complexities.
  • The presented 3D assembly method offers a promising direction for future innovations in the field.