High-Precision Thin Wall Bipolar Plates for Fuel Cell Applications via Injection Compression Molding with Dynamic...

In recent years, the demand for polymer compound solutions for the application of bipolar plates in polymer electrolyte membrane fuel cells (PEMFC) has increased continuously due to significant cost and lifetime advantages compared to metallic solutions. The main challenge of the compounds is the high filler content required to ensure sufficient electrical conductivity of the bipolar plates. The associated increase in viscosity and simultaneously increased thermal conductivity limit the conventional injection molding process in terms of achievable flow path length to wall thickness ratios (plate aspect ratio). In order to evaluate the extent to which highly modified electrically conductive polymer material systems can be processed into thin-walled and highly dimensionally stable bipolar plates, an injection compression molding process with dynamic mold temperature control (ICM-DT) has been developed. For this purpose, a compound was prepared from polypropylene (PP) and graphite-flakes. The compound was characterized with respect to the achieved filler content, the electrical conductivity, as well as the pressure- and temperature-dependent solidification range. The ICM-DT experiments were carried out by varying the maximum mold temperature and the compression force. In addition, the process was designed with multiple compression and decompression steps to account for a possible pressure-dependent solidification of the compound. The plates were characterized with respect to the achieved plate aspect ratio and the flow-path-dependent dimensional thickness stability. It was shown that the plate aspect ratio could be increased by up to 125% with the maximum filler content compared to conventional injection molding processes provided in the literature. With the multi-stage ICM-DT process, it was also possible to optimize the thickness dimensional stability with a maximum deviation of 3% over the flow path.