Facile path for copper recovery from waste printed circuit boards via mechanochemical approach

Recycling copper (Cu⁰) from waste printed circuit boards (PCBs) is a prevalent challenge. Here, we propose a new pathway and reveal mechanisms for recovering Cu⁰ from waste PCBs via a mechanochemical approach. The successful application of mechanical force avoids using inorganic acid in the Cu⁰ recovery process. Our work demonstrates that ferric chloride (FeCl₃) was superior to ferric sulfate and ferric nitrate as a solid-phase reagent for Cu⁰ recovery due to chloride complexation. Under the induction of mechanical force, the Cu⁰ in the waste PCBs was oxidized by Fe³⁺ and complexed by Cl^¯ to form a meta-stable cuprous chloride, which was susceptible to leaching in an acidic liquid-phase system constructed by hydrolysis of ferric salt. Further mechanism analysis reveals that in the mechanochemical solid-phase reaction, Cu⁰, metallic impurities, metal oxides, and carbon materials from waste PCBs could also reduce Fe³⁺ to Fe²⁺. The optimum conditions for Cu⁰ recovery from waste PCB powder with FeCl₃ as a solid-phase reagent were: rotational speed of 500 rpm, Cu⁰:Fe³⁺ molar ratio of 1:20, and reaction time of 120 min, achieving the highest recovery of 99.6 wt%. This study presents a facile path for Cu⁰ recovery from waste PCBs for resource circulation.