The Effect of Reactive Sputtering on the Microstructure of Parylene-C

Sputtering technique involves the use of plasma that locally heats surfaces of substrates during the deposition of atoms or molecules. This modifies the microstructure by increasing crystallinity and the adhesive properties of the substrate. In this study, the effect of sputtering on the microstructure of parylene-C was investigated in an aluminum nitride (AlN)-rich plasma environment. The sputtering process was carried out for 30, 45, 90 and 120 min on a 5 μm thick parylene-C film. Topography and morphology analyses were conducted on the parylene-C/AlN bilayers. Based on the experimental data, the results showed that the crystallinity of parylene-C/AlN bilayers was increased after 30 min of sputtering and remained saturated for 120 min. A scratch-resistance test conducted on the bilayers depicted that a higher force is required to delaminate the bilayers on top of the substrate. Thus, the adhesion properties of parylene-C/AlN bilayers were improved on glass substrate by about 17% during the variation of sputtering time.