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Analysis of Microstrip Line with Asymmetric Arch Type Cross-Sectional Structure Using Micro Pattern Transfer Printing

Seungmin Woo1, Jaehyeok Choi1, Kwangjong Choi2

  • 1Department of Electrical and Computer Engineering, Sungkyunkwan University, 2066 Seobu-ro, Jangan-gu, Suwon 16419, Korea.

Sensors (Basel, Switzerland)
|August 12, 2022
PubMed
Summary
This summary is machine-generated.

The micro pattern transfer printing (MPTP) method creates flexible printed circuit boards (FPCBs) with lower signal loss for millimeter wave applications. This new fabrication technique significantly reduces insertion loss compared to conventional methods.

Keywords:
arch type cross-sectionflexible printed circuit boardlow loss transmission linemicro pattern transfer printing method

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Area of Science:

  • Electrical Engineering
  • Materials Science
  • Electromagnetics

Background:

  • Flexible printed circuit boards (FPCBs) are crucial for modern electronics, especially in high-frequency applications.
  • Minimizing signal loss (insertion loss) is critical for efficient performance in millimeter wave bands.
  • Conventional FPCB fabrication methods can introduce imperfections affecting signal integrity.

Purpose of the Study:

  • To present the manufacturing procedure and electrical properties of microstrip lines on FPCBs using the micro pattern transfer printing (MPTP) method.
  • To compare the MPTP method with conventional FPCB processes regarding insertion loss.
  • To investigate the impact of microstrip line cross-sectional shape on insertion loss for millimeter wave applications.

Main Methods:

  • Fabrication of microstrip lines on poly-cyclohexylene dimethylene terephthalate (PCT) substrates using the MPTP method.
  • Electromagnetic field simulations to analyze the effect of the microstrip line's cross-sectional shape (arch shape) on insertion loss.
  • Experimental measurement of insertion loss for MPTP-fabricated and conventionally fabricated FPCBs at 10 GHz.

Main Results:

  • Electromagnetic simulations confirmed that the arch shape created by MPTP reduces high-frequency insertion loss.
  • Optimized microstrip transmission line dimensions: 217 µm width, 30 cm length on a 50 µm thick PCT substrate.
  • Measured insertion loss: 0.37 dB/cm for MPTP FPCBs vs. 0.66 dB/cm for conventional FPCBs at 10 GHz.

Conclusions:

  • The MPTP method enables the fabrication of FPCBs with significantly lower insertion loss compared to conventional methods.
  • The MPTP process offers a viable solution for high-performance millimeter wave applications requiring superior signal integrity.
  • The optimized microstrip line design and MPTP fabrication contribute to enhanced electrical properties in flexible circuits.