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Published on: July 30, 2013
Mechanism Analysis and Multi-Scale Protection Design of GaN HEMT Induced by High-Power Electromagnetic Pulse
Lei Wang1, Changchun Chai1, Tianlong Zhao1
1Key Laboratory of Ministry of Education for Wide Band-Gap Semiconductor Materials and Devices, School of Microelectronics, Xidian University, Xi'an 710071, China.
This study details high-power electromagnetic pulse (EMP) damage to Gallium Nitride (GaN) high-electron-mobility transistors (HEMTs). Optimized device structures and circuit designs significantly enhance HEMT resistance to electromagnetic interference (EMI).
Area of Science:
- Materials Science
- Electrical Engineering
- Physics
Background:
- Severe electromagnetic conditions pose significant risks to modern electronic systems.
- Gallium Nitride (GaN) high-electron-mobility transistors (HEMTs) are crucial components in many electronic applications.
- Understanding the damage mechanisms of high-power electromagnetic pulses (EMPs) on GaN HEMTs is vital for reliability.
Purpose of the Study:
- To investigate the detailed damage effects of high-power electromagnetic pulses (EMPs) on GaN HEMTs.
- To elucidate the underlying physical mechanisms causing device damage.
- To propose and validate a multi-scale protection design for GaN HEMTs against high-power electromagnetic interference (EMI).
Main Methods:
- Detailed analysis of internal physical quantity variations within the GaN HEMT during EMP exposure.
- Device structure optimization, focusing on symmetry (Lgd=Lgs) and passivation layers.
- Circuit optimization, evaluating the impact of external resistive components.
- Simulation studies to verify the proposed protection strategies.
Main Results:
- Device damage is primarily caused by thermal accumulation effects, including self-heating, avalanche breakdown, and hot carrier emission.
- Symmetrical device structures (gate-to-drain and gate-to-source distances equal) exhibit a higher damage threshold than asymmetrical ones.
- Appropriate passivation layers enhance breakdown characteristics, improving anti-EMI capability.
- Series resistive components in the source and gate circuits significantly increase the device's EMP withstand capability.
Conclusions:
- The reliability of GaN devices operating in harsh electromagnetic environments can be improved through strategic design.
- Device structure optimization, particularly symmetry and passivation, is key to enhancing EMP resilience.
- Circuit-level protection using series resistors offers an effective method to bolster GaN HEMT immunity against EMPs.
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