Study on the Effect of Processing Parameters on Residual Stresses of Injection Molded Micro-Pillar Array

As one of the main methods for fabricating microstructured surfaces, micro-injection molding has the advantages of short cycle time, high production efficiency, and the potential for batch manufacturing. However, non-negligible residual stresses inside the molded part could affect the replication quality, dimensions, and physical properties of the microstructure. Therefore, studying the effects of processing parameters on residual stresses is a necessary prerequisite to ensure the successful fabrication of microstructured parts. In this paper, an injection molding simulation model of micro-pillar arrays was developed using molecular dynamics software, and a series of injection molding experiments were conducted. It was found that increasing the mold temperature and melt temperature can reduce the thermal residual stresses and molecular orientation stresses, and effectively improve the uniformity of residual stress distribution. The increase in the packing pressure can make the shear field of flow more intense and increase the molecular orientation stresses, thus making the residual stresses more severe.