A metallographic evaluation of the stainless steel-silver solder joint

A technique has been developed and described for the examination of the interface between dissimilar metals, utilizing electrolytic etching and gold electro-deposition procedures. This procedure permitted etching of both the constituents of the silver solder-stainless steel interface without differential leveling. The grain boundaries at the surface of the stainless steel interface were accentuated by the chemical action of the flux during the joining procedure and the notched grain boundaries influenced the nucleation of the silver solder. No evidence of alloying was found within the resolution of the instruments used.