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Transmitter and Receiver Circuits for a High-Speed Polymer Fiber-Based PAM-4 Communication Link
Frida Strömbeck1, Mingquan Bao1, Zhongxia Simon He1
1Microwave Electronics Laboratory, Chalmers University of Technology, 41258 Gothenburg, Sweden.
Sensors (Basel, Switzerland)
|September 9, 2022
Summary
This study presents a high-speed communication link using a radio frequency digital-to-analog converter (RF-DAC) and power detector (PD) fabricated with indium phosphide (InP) technology. The system achieves 30 Gbps data transmission over polymer microwave fiber (PMF) with high energy efficiency.
Area of Science:
- Electrical Engineering
- Optoelectronics
- Microwave Engineering
Background:
- High data rate communication systems are crucial for modern applications.
- Indium phosphide (InP) double heterojunction bipolar transistor (DHBT) technology offers excellent high-frequency performance.
- Polymer microwave fiber (PMF) presents a viable medium for high-frequency signal transmission.
Purpose of the Study:
- To design and fabricate a high data rate RF-DAC and a power detector (PD) for a communication link.
- To evaluate the performance of a communication link utilizing a PMF for signal transmission.
- To demonstrate high-speed data transmission with low bit error rate (BER) and high energy efficiency.
Main Methods:
- Fabrication of RF-DAC and PD using 250 nm InP DHBT technology.
- Integration of a pulse amplitude modulation (PAM) modulator and PD into a communication link with a 1-meter PMF.
- Measurement of the communication link's working frequency range, output power, bandwidth, and data transmission capabilities.
Main Results:
- The communication link operates in the 110–150 GHz frequency range.
- The PAM modulator exhibits a peak output power of 5 dBm and a -3 dB bandwidth of 43 GHz.
- The PMF link supports PAM-4 at 22 Gbps and PAM-2 at 30 Gbps with BER <10−12.
- Energy efficiency of the link is 4.1 pJ/bit (PAM-2) and 5.6 pJ/bit (PAM-4).
Conclusions:
- The developed InP DHBT-based RF-DAC and PD enable high-speed, energy-efficient communication over PMF.
- The compact Tx and Rx chips (0.83 mm2) are suitable for integration into various communication systems.
- This technology paves the way for next-generation terahertz communication systems.

