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Area of Science:

  • Photonics and Optical Engineering
  • Materials Science
  • Semiconductor Manufacturing

Background:

  • Optical interconnects are crucial for high-speed data transmission.
  • Front End of Line (FEOL) compatible integration is essential for advanced semiconductor manufacturing.
  • Polycrystalline silicon (poly:Si) offers potential for integrated photonics.

Purpose of the Study:

  • To present an on-chip 2D and 3D photonics integration solution.
  • To demonstrate the use of deposited polycrystalline silicon (poly:Si) for optical interconnects.
  • To showcase high-Q Photonic Crystal (PhC) resonators fabricated with this material.

Main Methods:

  • On-chip integration of deposited silicon on a bulk silicon wafer.
  • Detailed discussion of processing steps and configurations for deposited silicon.
  • Fabrication and characterization of high-Q Photonic Crystal (PhC) resonators using poly:Si.

Main Results:

  • Successful on-chip 2D and 3D photonics integration compatible with FEOL.
  • Demonstration of deposited silicon integration processing.
  • Achieved high-Q Photonic Crystal (PhC) resonators using deposited poly:Si.

Conclusions:

  • Deposited polycrystalline silicon (poly:Si) is a viable material for optical interconnects.
  • This integration method supports next-generation 2D and 3D integrated optical systems.
  • The developed technology enables advanced optical resonator applications in integrated photonics.