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I-line photolithographic metalenses enabled by distributed optical proximity correction with a deep-learning model
Optics Express
|October 13, 2022
Summary
Achieving high pattern fidelity in metalenses is challenging with photolithography. This study introduces an accurate lithographic model and optical proximity correction (OPC) for precise near-infrared metalens patterning using i-line technology.
Area of Science:
- Optics and Photonics
- Materials Science
- Nanotechnology
Background:
- High pattern fidelity is crucial for metalens and metasurface performance.
- Economic photolithography faces challenges with subwavelength structure resolution and process windows.
- Optical proximity correction (OPC) is essential but requires accurate lithographic models for metasurfaces.
Purpose of the Study:
- To develop an accurate lithographic model for metasurface patterning.
- To implement a distributed optical proximity correction (OPC) flow for near-infrared (NIR) metalens fabrication.
- To improve pattern fidelity and focusing efficiency in NIR metalenses using i-line photolithography.
Main Methods:
- Utilized Hopkin's image formulation and fully convolutional networks (FCN) for lithographic modeling.
- Employed a distributed OPC flow to control critical dimension (CD) patterning.
- Fabricated a 1.5 mm diameter NIR metalens with a numerical aperture (NA) of 0.45 using i-line photolithography.
Main Results:
- Achieved an average critical dimension (CD) error of 1.69% due to process variations.
- Successfully patterned a 260 nm CD in the metalens layout, corresponding to a lithographic constant k1 of 0.46.
- Fabricated NIR metalens demonstrated a measured focusing efficiency of 64%, closely matching the calculated 69%.
Conclusions:
- The developed lithographic model and OPC flow enable precise patterning for NIR metalenses.
- The study demonstrates high focusing efficiency for metalenses fabricated using i-line photolithography.
- This approach overcomes limitations of conventional photolithography for advanced metasurface applications.

