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Updated: Aug 25, 2025

Fabrication of Uniform Nanoscale Cavities via Silicon Direct Wafer Bonding
Published on: January 9, 2014
Process method of Si3N4 ceramic brazing sealed cavity for high-temperature application
Chen Li1,2,3, Zhihong Fang1,2, Boshan Sun2,3
1Science and Technology on Electronic Test and Measurement Laboratory, North University of China, Taiyuan, China.
This study presents a novel method for creating high-temperature vacuum-sealed cavities using silicon nitride (Si3N4) ceramic and advanced brazing techniques. The developed sealed cavities demonstrate excellent bonding strength and stability in extreme thermal conditions.
Area of Science:
- Materials Science
- Ceramic Engineering
- Vacuum Technology
Background:
- Silicon nitride (Si3N4) ceramics are crucial for high-temperature applications.
- Developing robust vacuum-sealed cavities for extreme environments remains a challenge.
- Existing sealing methods often fail under high thermal stress.
Purpose of the Study:
- To develop a reliable vacuum-sealed cavity using Si3N4 ceramic suitable for high-temperature environments.
- To investigate the bonding strength and thermal stability of the prepared sealed cavities.
- To enable the development of high-temperature pressure sensors.
Main Methods:
- Utilized vacuum brazing and chemical reaction at 1,100°C and 0.5 MPa.
- Employed Si3N4 ceramic polishing, thinning, and inductively coupled plasma etching.
- Applied high-temperature metal filler (Ti-Zr-Cu-Ni) brazing process.
Main Results:
- Successfully prepared a vacuum-sealed Si3N4 ceramic cavity.
- Characterization via SEM and EDS confirmed intact cavity structure and well-bonded Si3N4 ceramics.
- Bonding interface strength exceeded 5.13 MPa and remained stable at 1,000-1,100°C for 1 hour.
Conclusions:
- The proposed vacuum brazing method effectively creates durable Si3N4 ceramic sealed cavities.
- The sealed cavities exhibit exceptional thermal stability, suitable for high-temperature applications.
- This technique paves the way for manufacturing high-temperature resistant pressure sensors.
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