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Correcting for digital image correlation speckle inversion at high temperature using color cameras.

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    Speckle pattern inversion in high-temperature digital image correlation (DIC) can be mitigated. A new histogram rescaling method effectively corrects pattern inversion without requiring quasi-static loading or causing optical distortions.

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    Area of Science:

    • Materials Science
    • Optical Engineering
    • Mechanical Engineering

    Background:

    • Digital image correlation (DIC) is a noncontacting technique for measuring full-field deformation.
    • Its noncontact nature allows DIC for extreme temperature applications, such as rocket nozzle testing, where bonded gauges fail.
    • Speckle pattern inversion, caused by blackbody radiation at high temperatures, can hinder DIC accuracy by inverting surface patterns.

    Purpose of the Study:

    • To compare and evaluate methods for mitigating speckle pattern inversion during high-temperature DIC.
    • To introduce and validate a novel histogram rescaling method for correcting speckle pattern inversion.

    Main Methods:

    • Comparison of three speckle pattern inversion mitigation techniques: subtraction method, filtering method, and histogram rescaling method.
    • The histogram rescaling method utilizes a color camera, blue light source, and postprocessing correction based on green sensor data.
    • Evaluation of methods based on their effectiveness in eliminating inversion and their practical limitations.

    Main Results:

    • The histogram rescaling method successfully eliminated speckle pattern inversion.
    • Unlike other methods, histogram rescaling does not require quasi-static loading conditions.
    • This method avoids the thick-glass distortions associated with optical filters.

    Conclusions:

    • The histogram rescaling method offers a robust and advantageous solution for high-temperature DIC, overcoming limitations of existing techniques.
    • This technique enhances the reliability of DIC measurements in extreme environments.
    • Further research may explore its application in dynamic high-temperature testing scenarios.