Grinding edge machining process on small-sized lens module components in a mobile phone

Area of Science:

• Optics and photonics
• Materials science and engineering
• Manufacturing processes

Background:

• Periscope phone lenses offer significant application potential.
• Large edge chipping during the grinding of periscope lens module components hinders development.
• Addressing chipping is vital for advancing periscope camera technology.

Purpose of the Study:

• To investigate the impact of grinding parameters on edge chipping size in periscope phone lens components.
• To identify optimal grinding conditions for minimizing chipping.
• To provide solutions for improving the manufacturing yield of periscope lens modules.

Main Methods:

• Theoretical simulation analysis of grinding parameters (speed, feed, depth).
• Single-factor variable experimental verification.
• Yield experiments using optimized process parameters.

Main Results:

• Increased grinding speed effectively reduces edge chipping size.
• Decreased feed speed and grinding depth also suppress chipping.
• Optimal grinding parameters were identified and validated through experiments.

Conclusions:

• Grinding speed, feed speed, and grinding depth are critical factors influencing edge chipping.
• Specific adjustments to these parameters can significantly reduce chipping size.
• The findings offer a pathway to enhance the manufacturing quality and development of periscope phone lenses.