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Updated: Aug 23, 2025

High Throughput Microfluidic Rapid and Low Cost Prototyping Packaging Methods
Published on: December 23, 2013
Jaeseok Lee1,2, Minseok Kim1,2
1Department of Mechanical System Engineering, Kumoh National Institute of Technology, Gumi 39177, Korea.
This study introduces a new method for creating rigid polymer microfluidic devices using epoxy resin, overcoming the limitations of flexible polydimethylsiloxane (PDMS) for demanding lab-on-chip applications.
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