Thermo-Mechanical Coupling Model of Bond-Based Peridynamics for Quasi-Brittle Materials

The mechanical properties of quasi-brittle materials, which are widely used in engineering applications, are often affected by the thermal condition of their service environment. Moreover, the materials appear brittle when subjected to tensile loading and show plastic characteristics under high pressure. These two phenomena manifest under different circumstances as completely different mechanical behaviors in the material. To accurately describe the mechanical response, the material behavior, and the failure mechanism of quasi-brittle materials with the thermo-mechanical coupling effect, the influence of the thermal condition is considered in calculating bond forces in the stretching and compression stages, based on a new bond-based Peridynamic (BB-PD) model. In this study, a novel bond-based Peridynamic, fully coupled, thermo-mechanical model is proposed for quasi-brittle materials, with a heat conduction component to account for the effect of the thermo-mechanical coupling. Numerical simulations are carried out to demonstrate the validity and capability of the proposed model. The results reveal that agreement could be found between our model and the experimental data, which show good reliability and promise in the proposed approach.