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A Study on Over-Molded Copper-Based Flexible Electronic Circuits.

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Summary

This study enhances over-molding processes for flexible circuit boards by investigating parameters like substrate material, solder type, and mold design. Findings aim to improve the reliability of integrated electronic components in plastic parts.

Keywords:
film insert-based technologyflexible printed circuit boardsinjection molding

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Area of Science:

  • Materials Science
  • Manufacturing Engineering
  • Electrical Engineering

Background:

  • Over-molding integrates flexible circuit boards into plastic parts using film insert technology.
  • This technique offers potential for diverse electrical functions in various geometries, particularly in automotive and home appliances.
  • Manufacturing challenges in foil fabrication and injection molding impact the reliability of these electronic flexible circuits.

Purpose of the Study:

  • To investigate and improve over-molding process parameters for enhanced reliability of integrated flexible circuits.
  • To characterize the electrical, mechanical, and failure behavior of over-molded zero-ohm resistors.
  • To analyze the influence of substrate materials, interconnect methods, mold designs, and injection parameters on component performance.

Main Methods:

  • Electrical, mechanical, and failure characterization of 0805 and 1206 over-molded zero-ohm resistors.
  • Components were mounted on polyimide (PI) and polyethylene terephthalate (PET) substrates in parallel, perpendicular, and 45° angled arrangements.
  • Utilized lead-free solder, low-melt solder, conductive adhesive paste, polycarbonate (PC) over-molding material, and varied mold shapes and injection parameters.

Main Results:

  • Evaluated the impact of different substrate materials (PI, PET) and interconnects (lead-free solder, low-melt solder, conductive adhesive) on resistor performance.
  • Assessed the influence of mold shapes (corner, 2 mm flat, 3 mm flat) and injection parameters (speed, melt temperature) on the over-molding process.
  • Characterized electrical, mechanical, and failure properties under various process conditions.

Conclusions:

  • The study provides insights into optimizing over-molding parameters for reliable integration of flexible circuits.
  • Understanding the interplay between materials, geometry, and processing conditions is crucial for successful application.
  • Results contribute to advancing the manufacturing of integrated electronic components in plastic parts.