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Twin-Boundary Reduced Surface Diffusion on Electrically Stressed Copper Nanowires.

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  • 1Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu30013, Taiwan, ROC.

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|November 7, 2022
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Summary

Copper nanowires with nanoscale defects transform into a zigzag shape due to electric-current driven surface diffusion. This controlled surface diffusion offers a new method for creating robust interconnect materials for nanoelectronics.

Keywords:
atomic migration energycopper nanowireelectromigrationnanotwinsurface diffusion

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Area of Science:

  • Materials Science
  • Surface Science
  • Nanotechnology

Background:

  • Surface diffusion significantly influences material phase transformation and structural evolution.
  • Understanding surface diffusion is crucial for designing advanced materials.

Purpose of the Study:

  • To investigate the evolution of copper nanowires under electric-current driven surface diffusion.
  • To elucidate the role of nanoscale defects, specifically coherent twin boundaries (CTBs), in this process.

Main Methods:

  • In situ transmission electron microscopy (TEM) for real-time observation of copper nanowire evolution.
  • Density functional theory (DFT) computations to determine energy barriers for atomic migration.

Main Results:

  • Copper nanowires with dense CTB defects adopted a stable zigzag configuration.
  • CTB-intercepted concave triple junctions significantly hindered surface diffusion, reducing diffusivity by nearly one order of magnitude.
  • DFT calculations confirmed energy barriers for atomic migration at junctions and faceted surfaces.

Conclusions:

  • The stable zigzag surface morphology results from a combination of high-diffusivity facets and stalled diffusion at concave junctions.
  • Defect engineering, specifically utilizing CTBs, can control surface diffusion and mitigate electromigration failures.
  • This research offers a pathway for developing robust interconnect materials for nanoelectronic devices.