Effect of Surface Dissolution on Dislocation Activation in Stressed FeSi6.5 Steel
Dong Zhao1, Feng Ye1, Binbin Liu1
1State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, 30 Xueyuan Road, Beijing 100083, China.
Abstract:
The effects of surface dissolution on dislocation activation in FeSi6.5 steel are quantitatively studied by analyzing the stress relaxation data using the thermal activation theory of dislocation. The stressed FeSi6.5 steel sample in acid solutions (H2SO4 or HCl) exhibits a much higher rate of stress reduction with time compared with that in air or deionized water. As the stress relaxation time is prolonged to 20 min, the relaxation rates are 0.055 MPa·min-1 in water and 0.074, 0.1, 0.11 MPa·min-1 in H2SO4 solutions with pH 4, 3, and 2, respectively. In a NaCl solution, a slight increase in the relaxation rate compared with air was found. Higher acidity (lower pH) of the solution inducing higher stress relaxation rate implies the softening is associated with the anodic dissolution of the surface layer and the accelerated (additional) flow of dislocations. The analyses using the thermal activation theory of dislocation during relaxation reveal the mechanism for the accelerated plastic flow induced by the corrosive medium. The variations of these parameters are related to the relaxation of the stress field of dislocations and the weakening of interaction between slip dislocations and short-range obstacles. The chemomechanical effect, including a reduction in apparent activation energy and a decrease in waiting time for dislocation to obtain sufficient thermal activation energy to cross obstacles, causes an increase in the stress relaxation rate (plastic strain rate). The study confirms that surface dissolution accelerates the plastic flow of metals and supports the view that surface dissolution facilitates dislocation slip. It is helpful to improve the formability of brittle metals.
More Related Videos
11:14Comprehensive Characterization of Extended Defects in Semiconductor Materials by a Scanning Electron Microscope
Published on: May 28, 2016
07:37Full-field Strain Measurements for Microstructurally Small Fatigue Crack Propagation Using Digital Image Correlation Method
Published on: January 16, 2019
Related Concept Videos
Stress-Strain Diagram - Ductile Materials
Residual Stresses
Stress Concentrations
Factors Affecting Dissolution: Particle Size and Effective Surface Area
Temperature Dependent Deformation
Plastic Behavior
