A Ku-Band Miniaturized System-in-Package Using HTCC for Radar Transceiver Module Application

Area of Science:

• Electrical Engineering
• Materials Science
• Radio Frequency (RF) Engineering

Background:

• High-power transceiver chips generate significant heat, posing a challenge for miniaturization.
• Existing packaging solutions often struggle to balance thermal management with high integration density.
• Ku-band RF systems require robust front-ends for applications like radar.

Purpose of the Study:

• To develop a miniaturized system in package (SIP) for a Ku-band four-channel RF transceiver front-end.
• To address the heat dissipation challenges associated with high-power transceiver chips within a compact form factor.
• To demonstrate the feasibility of using High Temperature Co-fired Ceramics (HTCC) technology for integrated RF transceivers.

Main Methods:

• Designed a SIP utilizing an inner heat-dissipation gasket and multi-layer substrate within an HTCC shell.
• Integrated five bidirectional amplifier chips, an amplitude-phase control chip, and two power modulation chips.
• Incorporated a metal heat sink at the bottom of the SIP for enhanced thermal management.

Main Results:

• Achieved a transmitting power exceeding 0.5 W (27 dBm) and a receiving noise figure of 3.4 dB in the Ku-band.
• Successfully integrated multiple chips within a 14.0 × 14.0 × 2.5 mm³ package.
• Demonstrated efficient heat dissipation, high air tightness, and excellent integration.

Conclusions:

• The developed SIP effectively manages heat, enabling stable performance for Ku-band transceiver applications.
• The HTCC-based SIP offers a promising solution for compact and high-performance radar transceiver systems.
• The packaging technology facilitates high integration and reliable operation in both receiving and transmitting states.