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Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing
Published on: July 3, 2020
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Apparent Young's Modulus of Epoxy Adhesives
Kamil Anasiewicz1, Józef Kuczmaszewski1
1Department of Mechanical Engineering, Lublin University of Technology, 20-618 Lublin, Poland.
Materials (Basel, Switzerland)
|November 26, 2022
Summary
This study reveals how epoxy adhesive properties change within joints. Adhesive joint thickness significantly impacts Young
Area of Science:
- Materials Science
- Adhesion Science
- Polymer Engineering
Background:
- Epoxy adhesives are crucial in various engineering applications.
- Understanding their mechanical properties within joints is vital for structural integrity.
- Variations in Young's modulus can affect joint performance.
Purpose of the Study:
- To investigate the mechanical properties of epoxy adhesives within adhesive joints.
- To analyze how Young's modulus changes with adhesive rigidity and substrate type.
- To determine the influence of adhesive joint thickness on Young's modulus values.
Main Methods:
- Nanoindentation was used to measure Young's modulus at the microscale within the adhesive joint.
- Tensile testing of bulk adhesive samples provided reference Young's modulus values.
- Analysis focused on Young's modulus variation with distance from the substrate-adhesive interface.
Main Results:
- Young's modulus varied significantly across the adhesive joint thickness.
- Distinct zones (wall-adjacent and core) exhibited different Young's modulus values.
- A correlation was observed between increased adhesive joint thickness and higher Young's modulus.
Conclusions:
- The mechanical properties of epoxy adhesives are not uniform within an adhesive joint.
- Adhesive joint thickness is a critical factor influencing the effective Young's modulus.
- The Young's modulus of the adhesive joint differs substantially from that of the bulk adhesive material.
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