Fluorine-Containing Flow Modifier for BN/PPS Composites Enabled by Low Surface Energy.

Area of Science:

• Materials Science
• Polymer Science
• Nanotechnology

Background:

• Electronic packaging requires materials with high thermal conductivity and excellent dielectric properties.
• Improving filler dispersion and matrix interaction is crucial for composite performance.
• Boron Nitride (BN) and Polyphenylene Sulfide (PPS) are key components in advanced composites.

Purpose of the Study:

• To synthesize a fluorine-containing flow modifier (Si-DF) for enhanced BN/PPS composites.
• To investigate the effect of Si-DF on the dispersion and interfacial interaction of BN fillers in a PPS matrix.
• To develop high-performance electronic packaging materials with improved thermal conductivity, dielectric properties, processability, and toughness.

Main Methods:

• Synthesis of a fluorine-containing flow modifier (Si-DF) with low surface energy.
• Fabrication of BN/PPS composites using conventional melt blending.
• Characterization of thermal conductivity, dielectric properties, processability (torque value), and mechanical toughness (stress-strain curves).

Main Results:

• Si-DF successfully modified the interface between BN fillers and the PPS matrix, improving BN dispersion and interfacial interaction.
• BN/PPS/Si-DF (70/25/5) composites achieved a high thermal conductivity coefficient of 3.985 W/m·K.
• The composites maintained a low dielectric constant of 3.76 at 100 MHz, even with 70 wt% BN loading.
• Enhanced processability was observed with a lower stable torque value (2.5 N·m) and increased toughness.

Conclusions:

• The synthesized Si-DF is an effective additive for developing high-performance BN/PPS composites.
• The modified composites exhibit excellent thermal conductivity and dielectric properties suitable for electronic packaging.
• This approach offers an efficient route to high-performance polymer composites for demanding electronic applications.