Use of Chipless RFID as a Passive, Printable Sensor Technology for Aerospace Strain and Temperature Monitoring

Area of Science:

• Materials Science and Engineering
• Electrical Engineering
• Aerospace Engineering

Background:

• Existing structural health monitoring (SHM) systems often require complex wiring or active components.
• The need for in-situ, passive, and wireless sensing technologies for aerospace applications is growing.
• Chipless radio frequency identification (RFID) technology offers potential for low-cost, integrated sensing solutions.

Purpose of the Study:

• To advance the development of chipless RFID sensors capable of simultaneously measuring strain and temperature.
• To evaluate the feasibility of these sensors for passive wireless SHM applications.
• To explore in-situ printing capabilities for sensor deployment.

Main Methods:

• Development of novel chipless RFID sensor designs for strain and temperature.
• Performance characterization including sensitivity analysis.
• Investigation of interrogation systems tailored for aerospace requirements.
• Exploration of techniques to improve multi-sensor support.

Main Results:

• Achieved a strain sensor sensitivity of 9.77 MHz/%ε.
• Achieved a temperature sensor sensitivity of 0.88 MHz/°C.
• Demonstrated the potential for in-situ printable passive wireless sensors.

Conclusions:

• Novel chipless RFID sensors for strain and temperature have been successfully developed and characterized.
• The developed technology shows promise for passive wireless SHM in aerospace.
• Further development of interrogation systems and multi-sensor capabilities is crucial for practical implementation.