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System-on-chip approach microwave imaging reflectometer on DIII-D tokamak.

Y Zhu1, Y Chen1, J-H Yu1

  • 1Department of Electrical and Computer Engineering, University of California Davis, Davis, California 95616, USA.

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|December 3, 2022
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Summary

This study upgrades the millimeter-wave imaging reflectometer (MIR) for fusion plasma diagnostics using advanced CMOS technology. The enhanced V-band MIR system improves density fluctuation imaging on the DIII-D tokamak.

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Area of Science:

  • Plasma Physics
  • Fusion Energy Research
  • Microwave Engineering

Background:

  • The DIII-D tokamak requires advanced diagnostics for studying plasma behavior.
  • Previous millimeter-wave imaging reflectometer (MIR) systems faced limitations in power delivery and spatial constraints.

Purpose of the Study:

  • To upgrade the two-dimensional MIR system for enhanced density fluctuation imaging on the DIII-D tokamak.
  • To implement a V-band system utilizing customized CMOS integrated circuits for improved performance.

Main Methods:

  • Development of customized CMOS chips for transmitter and receiver modules operating in the 55-75 GHz band.
  • Integration of an active frequency multiplier chain, replacing quasi-optical local oscillator coupling.
  • Incorporation of a 55-75 GHz low noise amplifier in the receiver module.

Main Results:

  • Successful development and implementation of a V-band MIR system on the DIII-D tokamak.
  • Achieved a 20 dB gain improvement and better than -75 dBm sensitivity in receiver modules.
  • Reduced electronics noise temperature from 55,000 K to 11,200 K.

Conclusions:

  • The upgraded V-band MIR system, leveraging system-on-chip technology, significantly enhances density fluctuation imaging capabilities.
  • The new system facilitates co-located multi-field investigation of MHD-scale fluctuations in the pedestal region.
  • This advancement supports detailed analysis of fusion plasma dynamics.