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System-on-chip approach microwave imaging reflectometer on DIII-D tokamak
1Department of Electrical and Computer Engineering, University of California Davis, Davis, California 95616, USA.
The Review of Scientific Instruments
|December 3, 2022
Summary
This study upgrades the millimeter-wave imaging reflectometer (MIR) for fusion plasma diagnostics using advanced CMOS technology. The enhanced V-band MIR system improves density fluctuation imaging on the DIII-D tokamak.
Area of Science:
- Plasma Physics
- Fusion Energy Research
- Microwave Engineering
Background:
- The DIII-D tokamak requires advanced diagnostics for studying plasma behavior.
- Previous millimeter-wave imaging reflectometer (MIR) systems faced limitations in power delivery and spatial constraints.
Purpose of the Study:
- To upgrade the two-dimensional MIR system for enhanced density fluctuation imaging on the DIII-D tokamak.
- To implement a V-band system utilizing customized CMOS integrated circuits for improved performance.
Main Methods:
- Development of customized CMOS chips for transmitter and receiver modules operating in the 55-75 GHz band.
- Integration of an active frequency multiplier chain, replacing quasi-optical local oscillator coupling.
- Incorporation of a 55-75 GHz low noise amplifier in the receiver module.
Main Results:
- Successful development and implementation of a V-band MIR system on the DIII-D tokamak.
- Achieved a 20 dB gain improvement and better than -75 dBm sensitivity in receiver modules.
- Reduced electronics noise temperature from 55,000 K to 11,200 K.
Conclusions:
- The upgraded V-band MIR system, leveraging system-on-chip technology, significantly enhances density fluctuation imaging capabilities.
- The new system facilitates co-located multi-field investigation of MHD-scale fluctuations in the pedestal region.
- This advancement supports detailed analysis of fusion plasma dynamics.

