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A New Insight into High-Aspect-Ratio Channel Drilling in Translucent Dielectrics with a KrF Laser for Waveguide
Igor V Smetanin1, Alexey V Shutov1, Nikolay N Ustinovskii1
1P. N. Lebedev Physical Institute, Leninskii Prospekt, 53, 119991 Moscow, Russia.
Materials (Basel, Switzerland)
|December 11, 2022
Summary
Researchers reveal a novel mechanism for creating high-aspect-ratio capillary channels in transparent materials using nanosecond ultraviolet laser pulses. This process involves laser beam filamentation and filamentation-assisted ablation for advanced material processing.
Area of Science:
- Laser Physics
- Materials Science
- Nanotechnology
Background:
- High aspect ratio capillary channels are crucial for various applications.
- Understanding laser-matter interactions in transparent materials is challenging.
- Existing methods for channel fabrication have limitations.
Purpose of the Study:
- To investigate the mechanism of capillary channel formation in translucent matter using nanosecond UV laser pulses.
- To explore laser beam filamentation and its role in ablation.
- To demonstrate a similar mechanism in highly transparent media.
Main Methods:
- Experimental multi-pulse drilling of polymethyl methacrylate and K8 silica glass using KrF laser.
- Analysis of laser beam filamentation and material densification.
- Investigation of multiphoton absorption in KU-1 glass.
Main Results:
- A self-consistent mechanism involving laser beam filamentation and filamentation-assisted ablation was proposed.
- This mechanism was observed in both polymethyl methacrylate and K8 silica glass.
- A similar process, initiated by multiphoton absorption, was identified in KU-1 glass.
Conclusions:
- Nanosecond UV laser pulses can effectively create high aspect ratio capillary channels.
- Laser beam filamentation plays a key role in the proposed ablation mechanism.
- The findings have implications for laser-driven electron acceleration and pulse compression.
Keywords:
laser beam filamentation and waveguide propagation in long capillary channelmulti-pulse drilling of dielectric materials by KrF laser
