Precipitation Behavior during Aging Operations in an Ultrafine-Grained Al-Cu-Mg Alloy Produced by High-Strain-Rate...

An ultrafine-grained (UFG) Al-Cu-Mg alloy (AA2024) was produced by surface mechanical grinding treatment (SMGT) with a high strain rate, and the precipitation behavior inside the grain and at the grain boundary was investigated. During SMGT, element segregation at the boundary was rarely observed, since the solute atoms were impeded by dislocations produced during SMGT. During early aging, the atomic fraction of Cu at the grain boundary with SMGT alloys was approximately 2.4-fold larger than that without SMGT alloys, the diffusion rate of Cu atoms from the grain toward the grain boundaries was accelerated with SMGT alloys, because a higher local elastic stress and diffusion path were provided by high-density dislocations. The combined action, in terms of the composition of the alloy, the atomic radius, the diffusion path, and the diffusion driving force provided by high-density dislocations with SMGT alloys, led to a Cu/Mg atomic ratio of approximately 6.8 at the grain boundary. The average size of the precipitates inside the grain was approximately 2- and 10-fold larger than that formed after later aging with and without SMGT alloys, due to more nucleation sites at dislocation located inside the grain with SMGT alloys having attracted and captured numerous solute atoms during the aging process.