Reliability of printed stretchable electronics based on nano/micro materials for practical applications

Area of Science:

• Materials Science
• Electrical Engineering
• Nanotechnology

Background:

• Stretchable electronics fabricated with nano/micro composite inks are rapidly advancing.
• Printing offers a scalable and cost-effective method for creating these devices.
• Existing research often prioritizes high stretchability over practical reliability.

Purpose of the Study:

• To review common failure modes in printed stretchable electronics.
• To identify challenges hindering practical application of stretchable electronics.
• To propose strategies for improving the reliability of these devices.

Main Methods:

• Literature review of failure mechanisms in printed stretchable electronics.
• Analysis of challenges including interconnect dysfunction, interface stress, via vulnerability, thermal issues, and material instability.
• Discussion of proposed solutions for enhancing device reliability.

Main Results:

• Identified key failure modes: interconnects, rigid-soft interfaces, vias, thermal accumulation, and environmental instability.
• Highlighted the need to address these modes for practical implementation.
• Outlined strategies to overcome these reliability challenges.

Conclusions:

• Reliable, printable, stretchable electronics are crucial for transitioning from demonstrations to real-world applications.
• Addressing identified failure modes is essential for advancing the field.
• This review provides a roadmap for developing robust stretchable electronic systems.