Jove
Visualize
Contact Us
JoVE
x logofacebook logolinkedin logoyoutube logo
ABOUT JoVE
OverviewLeadershipBlogJoVE Help Center
AUTHORS
Publishing ProcessEditorial BoardScope & PoliciesPeer ReviewFAQSubmit
LIBRARIANS
TestimonialsSubscriptionsAccessResourcesLibrary Advisory BoardFAQ
RESEARCH
JoVE JournalMethods CollectionsJoVE Encyclopedia of ExperimentsArchive
EDUCATION
JoVE CoreJoVE BusinessJoVE Science EducationJoVE Lab ManualFaculty Resource CenterFaculty Site
Terms & Conditions of Use
Privacy Policy
Policies

Related Concept Videos

You might also read

Related Articles

Articles linked to this work by shared authors, journal, and citation graph.

Sort by
Same author

Manipulating Thermal Transport of 2D MOFs by Hierarchical Structural Design.

Small (Weinheim an der Bergstrasse, Germany)·2026
Same author

Correction to: The role of digital rehabilitation therapy in enhancing upper limb function recovery following surgery in breast cancer patients.

Supportive care in cancer : official journal of the Multinational Association of Supportive Care in Cancer·2026
Same author

Tandem Dual-Anode Electrochemical Reactor for Valorizing Chlorinated Aromatic Pollutants into Tailorable Polymeric Adsorbent.

Journal of the American Chemical Society·2026
Same author

The effectiveness and safety of isoperistaltic versus antiperistaltic side-to-side ileocolic anastomosis in minimally invasive radical right hemicolectomy: a systematic review and meta-analysis.

International journal of colorectal disease·2026
Same author

The role of digital rehabilitation therapy in enhancing upper limb function recovery following surgery in breast cancer patients.

Supportive care in cancer : official journal of the Multinational Association of Supportive Care in Cancer·2026
Same author

SINAT proteins modulate autophagic vesicle degradation by regulating V-ATPase subunit proteolysis in Arabidopsis.

Autophagy·2026

Related Experiment Video

Updated: Aug 16, 2025

Optimized Fabrication Procedure for High-Quality Graphene-based Moiré Superlattice Devices
11:24

Optimized Fabrication Procedure for High-Quality Graphene-based Moiré Superlattice Devices

Published on: July 11, 2025

5.5K

High-Precision Wafer Bonding Alignment Mark Using Moiré Fringes and Digital Grating.

Jianhan Fan1, Sen Lu2, Jianxiao Zou1,3

  • 1School of Automation Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China.

Micromachines
|December 23, 2022
PubMed
Summary

This study introduces a moiré-based mark for precise wafer bonding alignment. The digital grating and moiré fringes enable highly stable and accurate offset calculations for improved semiconductor manufacturing.

Keywords:
moiré fringewafer bondingwafer bonding alignment

More Related Videos

Design and Development of a Three-Dimensionally Printed Microscope Mask Alignment Adapter for the Fabrication of Multilayer Microfluidic Devices
06:21

Design and Development of a Three-Dimensionally Printed Microscope Mask Alignment Adapter for the Fabrication of Multilayer Microfluidic Devices

Published on: January 25, 2021

3.0K
Micro/Nano-scale Strain Distribution Measurement from Sampling Moiré Fringes
06:56

Micro/Nano-scale Strain Distribution Measurement from Sampling Moiré Fringes

Published on: May 23, 2017

12.4K

Related Experiment Videos

Last Updated: Aug 16, 2025

Optimized Fabrication Procedure for High-Quality Graphene-based Moiré Superlattice Devices
11:24

Optimized Fabrication Procedure for High-Quality Graphene-based Moiré Superlattice Devices

Published on: July 11, 2025

5.5K
Design and Development of a Three-Dimensionally Printed Microscope Mask Alignment Adapter for the Fabrication of Multilayer Microfluidic Devices
06:21

Design and Development of a Three-Dimensionally Printed Microscope Mask Alignment Adapter for the Fabrication of Multilayer Microfluidic Devices

Published on: January 25, 2021

3.0K
Micro/Nano-scale Strain Distribution Measurement from Sampling Moiré Fringes
06:56

Micro/Nano-scale Strain Distribution Measurement from Sampling Moiré Fringes

Published on: May 23, 2017

12.4K

Area of Science:

  • Semiconductor Manufacturing
  • Optical Metrology
  • Materials Science

Background:

  • Wafer bonding alignment is critical for semiconductor device fabrication.
  • Existing alignment methods face challenges with precision and stability.
  • Moiré patterns offer potential for high-resolution metrology.

Purpose of the Study:

  • To investigate a novel moiré-based mark for high-precision wafer bonding alignment.
  • To evaluate the stability and accuracy of moiré fringe generation for alignment.
  • To validate the practical applicability of the proposed alignment mark.

Main Methods:

  • Superimposing a digital grating onto a moiré-based mark.
  • Generating moiré fringes from upper and lower wafer marks.
  • Performing phase calculations on moiré fringe images to determine wafer offset.

Main Results:

  • The moiré-based mark combined with digital grating achieves high alignment precision.
  • Moiré fringe generation demonstrated exceptional stability.
  • Experimental validation confirmed the mark's rationality and practicability for wafer alignment.

Conclusions:

  • The developed moiré-based mark is effective for high-precision wafer bonding alignment.
  • The method offers enhanced stability and accuracy compared to traditional techniques.
  • This approach shows significant promise for advanced semiconductor manufacturing processes.