Atomic-Scale Surface Engineering for Giant Thermal Transport Enhancement Across 2D/3D van der Waals Interfaces

Area of Science:

• Materials Science
• Condensed Matter Physics
• Nanotechnology

Background:

• Heat dissipation is crucial for 2D material-based electronics.
• Inefficient heat removal across van der Waals (vdW) interfaces limits device performance.
• The interface between 2D materials and 3D substrates is a thermal bottleneck.

Purpose of the Study:

• To investigate methods for enhancing interfacial thermal conductance (ITC) across 2D/3D vdW interfaces.
• To explore the impact of substrate surface modification on heat transfer.
• To provide insights into improving thermal management in 2D electronic devices.

Main Methods:

• Utilized an atomic-scale thin amorphous layer on a 3D substrate.
• Investigated the 2D-MoS₂/3D-GaN vdW interface.
• Employed phonon dynamics and heat flux spectrum analyses.
• Varied substrate surface roughness to study its effects.

Main Results:

• An amorphous layer enhanced ITC by a factor of 4 compared to a crystalline surface.
• ITC was tunable by adjusting substrate surface roughness.
• Increased phonon densities, channels, and coupling at the interface were observed.
• Substrate surface topology influenced MoS₂ thermal conductivity by altering phonon relaxation times.

Conclusions:

• Atomic-scale surface engineering with amorphous layers is effective for enhancing ITC.
• This approach offers a new strategy for improving heat dissipation in 2D electronic devices.
• Understanding interfacial phonon transport is key to thermal management in nanomaterials.