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Updated: Aug 14, 2025

Analysis of Contact Interfaces for Single GaN Nanowire Devices
Published on: November 15, 2013
Tuning interfacial thermal conductance of GaN/AlN heterostructure nanowires by constructing core/shell structure
Xue Ren1, Cheng-Wei Wu1, Shi-Yi Li1
1School of Materials Science and Engineering and Hunan Provincial Key Laboratory of Advanced Materials for New Energy Storage and Conversion, Hunan University of Science and Technology, Xiangtan 411201, People's Republic of China.
Abstract:
The ability to tune the interfacial thermal conductance of GaN/AlN heterojunction nanowires (NWs) with a core/shell structure is shown using molecular dynamics and non-equilibrium Green's functions method. In particular, an increase in the shell thickness leads to a significant improvement of interfacial thermal conductance of GaN/AlN core/shell NWs. At room temperature (300 K), the interfacial thermal conductance of NWs with specific core/shell ratio can reach 0.608 nW K-1, which is about twice that of GaN/AlN heterojunction NWs due to the weak phonon scattering and phonon localization. Moreover, changing the core/shell type enables one to vary interfacial thermal conductance relative to that of GaN/AlN heterojunction NWs. The results of the study provide an important guidance for solving the thermal management problems of GaN-based devices.
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