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Related Concept Videos

Atomic Force Microscopy01:08

Atomic Force Microscopy

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Atomic force microscopy (AFM) is a type of scanning probe microscopy that can analyze topographic details of various specimens like ceramics, glass, polymers, and biological samples. AFM offers over 1000 times more resolution than the optical imaging system. Images generated from AFM are three-dimensional surface profiles, offering an advantage over the flat, two-dimensional images from other imaging techniques.
The AFM Probe
The probe is regarded as the heart of any AFM setup and comprises the...
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Facet type determination based on combined atomic force microscopy and electron backscatter diffraction.

Ralf Brüning1, Mehrad Hajati2, Peter G Lelièvre2

  • 1Physics Department, Mount Allison University, Sackville, New Brunswick, Canada.

Journal of Microscopy
|January 18, 2023
PubMed
Summary

This study introduces a new method to map crystal facet types on polycrystalline films by combining electron backscatter diffraction and atomic force microscopy. This technique aids in understanding surface functionality and controlling roughness in applications like printed circuit board manufacturing.

Keywords:
atomic force microscopycrystal habit identificationelectroless copper platingelectron backscatter diffractionetched copper surfacefacet typespolycrystalline surfaces

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Area of Science:

  • Materials Science
  • Crystallography
  • Surface Science

Background:

  • Surface functionality of polycrystalline films is dictated by facet type distribution.
  • A convenient method for determining facet type distribution has been lacking.
  • Controlling surface roughness is critical in applications like printed circuit board (PCB) production.

Purpose of the Study:

  • To develop and demonstrate a method for determining and mapping Miller indexes (hkl) of crystal facets on polycrystalline film surfaces.
  • To provide a tool for analyzing facet distributions and their impact on surface properties.
  • To address challenges in controlling surface roughness during plating processes.

Main Methods:

  • Combines crystal orientation data from electron backscatter diffraction (EBSD) with topography data from atomic force microscopy (AFM).
  • Develops a process for transferring and aligning data from EBSD and AFM into a common coordinate system.
  • Details data processing steps and verification methods for accurate facet mapping.

Main Results:

  • Successfully determined and mapped the Miller indexes (hkl) of crystal facets on analyzed samples.
  • Demonstrated the method's utility on an etched copper clad laminate (CCL) and an electroless Cu film.
  • Provided a pathway to understand and potentially control facet selection in plating processes.

Conclusions:

  • The presented method offers a convenient way to determine crystal facet distributions on polycrystalline surfaces.
  • This technique can help in understanding and mitigating surface roughness issues in applications like PCB manufacturing.
  • Accurate facet mapping is crucial for controlling material properties and performance.