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Using Synchrotron Radiation Microtomography to Investigate Multi-scale Three-dimensional Microelectronic Packages

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Through-Silicon via Device Non-Destructive Defect Evaluation Using Ultra-High-Resolution Acoustic Microscopy System.

Tae Hyeong Kim¹, Dongchan Kang², Jeong Nyeon Kim³

¹Graduate School of Energy and Environment, Seoul National University of Science and Technology, 232 Gongneung-ro, Nowon-gu, Seoul 01811, Republic of Korea.

Materials (Basel, Switzerland)

|January 21, 2023

Summary

An ultra-high-resolution acoustic microscopy system was developed for non-destructive defect evaluation in thin films. This system successfully detected 20 μm void defects in a through-silicon via (TSV) semiconductor device.

Keywords:

TSV device acoustic microscopy system internal defect semiconductor

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Area of Science:

Materials Science
Non-Destructive Testing
Microscopy

Background:

Thin film structures are crucial in modern electronics.
Defects in these structures can lead to device failure.
Non-destructive evaluation methods are needed for quality control.

Purpose of the Study:

To fabricate an ultra-high-resolution acoustic microscopy system.
To develop integrated control software for system operation and data analysis.
To validate the system's performance in detecting defects in semiconductor devices.

Main Methods:

Fabrication of an integrated acoustic microscopy system with control, activation, and data acquisition modules.
Development of integrated control software for system operation and analysis of A-Scan signals.
Utilizing the developed system to analyze a through-silicon via (TSV) semiconductor device.

Main Results:

The developed ultra-high-resolution acoustic microscopy system successfully performed non-destructive evaluation.
Void defects measuring 20 μm were detected at a depth of approximately 32.5 μm in the TSV device using C-Scan imaging.
The detected defects were confirmed through cross-section analysis using focused ion beam (FIB) microscopy.

Conclusions:

The fabricated ultra-high-resolution acoustic microscopy system is effective for non-destructive defect detection in thin film structures.
The system demonstrated high resolution and accuracy in identifying micro-scale defects.
This technology holds promise for quality control and failure analysis in semiconductor manufacturing.