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CMP Pad Conditioning Using the High-Pressure Micro-Jet Method.

Xin Li1,2, Yinggang Wang1,2, Hongyu Chen1,2

  • 1College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310023, China.

Micromachines
|January 21, 2023
PubMed
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This summary is machine-generated.

High-pressure micro-jet (HPMJ) conditioning offers superior performance and longevity for chemical mechanical polishing pads compared to traditional diamond conditioning. This advanced method ensures cleaner pads and more stable material removal rates, reducing overall costs.

Area of Science:

  • Materials Science
  • Manufacturing Engineering

Background:

  • Chemical mechanical polishing (CMP) is crucial for semiconductor manufacturing.
  • Polishing pad performance degradation necessitates effective conditioning methods.
  • Reducing CMP costs while maintaining high performance is a key industry challenge.

Purpose of the Study:

  • To evaluate and compare the efficacy of high-pressure micro-jet (HPMJ) conditioning against traditional diamond conditioning for various polishing pads.
  • To assess the impact of conditioning methods on material removal rate stability and pad longevity.
  • To optimize CMP processes for improved performance and cost-effectiveness.

Main Methods:

  • Experimentation with three polishing pad types: polyurethane, damping cloth, and non-woven fabric.
Keywords:
chemical mechanical polishingconditioninghigh-pressure micro-jetpolishing padwear

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  • Comparative analysis of HPMJ conditioning versus diamond conditioning.
  • Scanning Electron Microscopy (SEM) to examine pad surface morphology and pore structure.
  • Measurement of material removal rate fluctuations under different conditioning methods.

    • Main Results:

    • HPMJ conditioning resulted in material removal rate fluctuation ranges of 2.73-3.75 μm/h, 1.38-1.99 μm/h, and 2.36-4.32 μm/h for the tested pads.
    • Diamond conditioning showed wider fluctuation ranges: 1.80-4.14 μm/h, 1.02-2.09 μm/h, and 1.78-5.88 μm/h.
    • SEM analysis revealed cleaner pad surfaces with unblocked pores after HPMJ conditioning, unlike diamond conditioning which left abrasive particles and blocked pores.

    Conclusions:

    • HPMJ conditioning technology significantly outperforms traditional diamond conditioning for polishing pads.
    • HPMJ conditioning leads to a longer service life and more stable material removal rates.
    • This method enhances polishing pad performance and reduces overall chemical mechanical polishing costs.