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Combined Additive and Laser-Induced Processing of Functional Structures for Monitoring under Deformation
Tawakalt Mayowa Akintola1,2, Balaji Krishna Kumar1,2, Tarik Dickens1,2
1Industrial & Manufacturing Engineering, FAMU-FSU College of Engineering, 2525 Pottsdamer St., Tallahassee, FL 32310, USA.
Polymers
|January 21, 2023
Summary
This study presents a non-chemical laser-induced graphene (LIG) method for conductive traces, optimizing properties by adjusting laser conditions. This technique addresses electrothermal challenges in electronic devices.
Area of Science:
- Materials Science
- Nanotechnology
- Additive Manufacturing
Background:
- Electronic devices face electrothermal challenges.
- Developing efficient conductive materials is crucial for device performance.
- Laser-induced graphene (LIG) offers a promising route for advanced electronics.
Purpose of the Study:
- To introduce a non-chemical, laser-induced writing process for fabricating conductive graphene traces.
- To investigate the influence of laser parameters on LIG structure and properties.
- To demonstrate LIG's potential in overcoming electrothermal issues in electronic devices.
Main Methods:
- Utilized a high-precision laser nScrypt printer with varied power, speed, and printing parameters.
- Employed Raman spectroscopy and scanning electron microscopy for material characterization.
- Conducted four-point probe measurements to assess electrical properties and gauge factor.
Main Results:
- Optimized laser conditions significantly improved LIG structure and properties.
- Higher crystalline size (159 nm) was observed at 3.2 W compared to 4 W (29 nm) due to controlled oxidation.
- Resistivity was three orders of magnitude higher at 3.8 W laser power, indicating tunable electrical characteristics.
- Gauge factor (GF) ranged from 17 at 0.5% strain to 141.36 at 5% strain, showing potential for strain sensing.
Conclusions:
- The laser-induced writing process is a viable method for producing high-quality conductive graphene traces.
- Adjusting laser conditions and printing parameters allows for precise control over LIG morphology and electrical performance.
- This approach offers a pathway to mitigate electrothermal issues and develop novel electronic and sensing applications.

