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Related Concept Videos

Accelerated Curing of Concrete01:25

Accelerated Curing of Concrete

211
Accelerating concrete curing is achieved by applying heat and additional moisture. This process accelerates the hydration of the cement, resulting in an earlier strength gain in the concrete. Steam curing is a method wherein the concrete products are either transported through a chamber on a conveyor belt or encased in plastic, allowing steam at atmospheric pressure to circulate freely around them. This process begins with a phase of moist curing that typically lasts between 3 to 5 hours, after...
211
Curing Methods01:26

Curing Methods

111
Concrete members with a small surface-to-volume ratio are cured by oiling and moistening the forms before casting the concrete member. These forms can be left in place for a prolonged period to prevent moisture loss, and can be wetted if made of a material suitable for wetting. If the forms are removed early, the concrete member is moistened and covered with polythene sheets to maintain moisture. For large horizontal concrete surfaces exposed to dry weather, a temporary covering is suspended...
111
Curing of Concrete01:20

Curing of Concrete

138
The hydration of cement takes place within the water-filled capillary pores. However, environmental elements can disrupt this process by evaporating water from the concrete surfaces. Sealed concrete with a water-cement ratio below 0.5 experiences self-desiccation, leading to water loss. The water loss in concrete is mitigated by curing. This technique involves keeping the concrete saturated to maintain the necessary temperature and moisture conditions, to optimally fill the spaces in the cement...
138

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Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
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Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure Cycles.

Seong Yeon Park1, Seung Yoon On1, Junmo Kim1

  • 1Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon305-701, Republic of Korea.

ACS Applied Materials & Interfaces
|January 25, 2023
PubMed
Summary

A new modified cure cycle significantly reduces semiconductor package warpage by incorporating rapid cooling. This method lowers bonding temperatures, enhancing reliability and increasing peel strength in thin electronic devices.

Keywords:
bonding temperaturecure cyclecure shrinkagecurvaturesemiconductor package

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Area of Science:

  • Materials Science
  • Mechanical Engineering
  • Semiconductor Manufacturing

Background:

  • Semiconductor package thinning is critical for modern electronics like smartphones.
  • Reduced package thickness exacerbates warpage issues due to lower bending stiffness.
  • Thermal residual stresses and thermal expansion mismatch during epoxy molding compound (EMC) curing drive warpage.

Purpose of the Study:

  • To develop a modified cure cycle to mitigate warpage in thin semiconductor packages.
  • To enhance the reliability of EMC/copper (Cu) bi-layer packages.
  • To investigate the impact of a rapid cooling step on package warpage and bonding strength.

Main Methods:

  • Developed a modified cure cycle with an added rapid cooling step.
  • Utilized Timoshenko theory for package modeling, incorporating effective cure shrinkage.
  • Quantified and experimentally validated the rapid cooling step's effects.

Main Results:

  • The modified cure cycle reduced residual strain by 26%.
  • Curvature was decreased by 27% compared to the conventional cure cycle (CCC).
  • Peel strength increased by 40% with the modified cure cycle.

Conclusions:

  • The modified cure cycle effectively manages warpage in thin semiconductor packages.
  • Rapid cooling is a viable strategy to improve EMC/Cu bi-layer package reliability.
  • This method offers a new approach to address warpage in advanced electronic packaging.