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Electronic Packaging Enhancement Engineered by Reducing the Bonding Temperature via Modified Cure Cycles.
Seong Yeon Park1, Seung Yoon On1, Junmo Kim1
1Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon305-701, Republic of Korea.
ACS Applied Materials & Interfaces
|January 25, 2023
Summary
A new modified cure cycle significantly reduces semiconductor package warpage by incorporating rapid cooling. This method lowers bonding temperatures, enhancing reliability and increasing peel strength in thin electronic devices.
Area of Science:
- Materials Science
- Mechanical Engineering
- Semiconductor Manufacturing
Background:
- Semiconductor package thinning is critical for modern electronics like smartphones.
- Reduced package thickness exacerbates warpage issues due to lower bending stiffness.
- Thermal residual stresses and thermal expansion mismatch during epoxy molding compound (EMC) curing drive warpage.
Purpose of the Study:
- To develop a modified cure cycle to mitigate warpage in thin semiconductor packages.
- To enhance the reliability of EMC/copper (Cu) bi-layer packages.
- To investigate the impact of a rapid cooling step on package warpage and bonding strength.
Main Methods:
- Developed a modified cure cycle with an added rapid cooling step.
- Utilized Timoshenko theory for package modeling, incorporating effective cure shrinkage.
- Quantified and experimentally validated the rapid cooling step's effects.
Main Results:
- The modified cure cycle reduced residual strain by 26%.
- Curvature was decreased by 27% compared to the conventional cure cycle (CCC).
- Peel strength increased by 40% with the modified cure cycle.
Conclusions:
- The modified cure cycle effectively manages warpage in thin semiconductor packages.
- Rapid cooling is a viable strategy to improve EMC/Cu bi-layer package reliability.
- This method offers a new approach to address warpage in advanced electronic packaging.
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