Photo-and Heat-Induced Dismantlable Adhesion Interfaces Prepared by Layer-by-Layer Deposition

The development of a dismantlable adhesion technology that allows switching between bonding and debonding states using external stimuli is important for realizing renewable and sustainable material cycles. Controlling the adhesion interface is an effective approach to manipulate the adhesion strength; however, research on dismantlable systems focusing on the interface has not been proceeded. Recently, we demonstrated a novel dismantlable system based on a stimuli-responsive molecular layer comprising cleavable anthracene dimers, which strengthen the initial adhesive force by forming chemical bonds between the substrate and adhesive and can be dismantled when required via stimulation-induced bond breaking. Here, we evaluate the use of the anthracene-based molecular layer with different components for verifying its versatility in the adhesive/dismantling system. The formation of the cleavable molecular layer by the stacking of relevant molecules enabled its usage with two types of adhesives, an epoxy adhesive and a silane-modified polymer adhesive. The initial adhesive strengths were improved in both types of molecular layers by creating chemical bonds at the adhesion interfaces. Light irradiation or heating stimuli for 1 min reduced the peel strength by up to 65%, and dismantling occurred in the cleavable photodimer layer. This study expands the versatile applicability of the molecular layer-based dismantling system.